? semiconductor components industries, llc, 2011 may, 2011 ? rev. 3 1 publication order number: CSPESD304/d CSPESD304 4-channel esd array in csp product description the CSPESD304 is a quad esd transient voltage suppression diode array. each diode provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (esd). these diodes safely dissipate esd strikes of 15 kv, exceeding the maximum requirement of the iec 61000 ? 4 ? 2 international standard. using the mil ? std ? 883 (method 3015) specification for human body model (hbm) esd, the device provides protection for contact discharges to greater than 30 kv. the CSPESD304 is particularly well ? suited for portable electronics (e.g., cellular telephones, pdas, notebook computers) because of its small package and low weight. the CSPESD304 is available in a space ? saving, low ? profile chip scale package with lead ? free finishing. features ? four channels of esd protection ? 15 kv esd protection on each channel (iec 61000 ? 4 ? 2 level 4, contact discharge) ? 30 kv esd protection on each channel (hbm) ? chip scale package features extremely low lead inductance for optimum esd protection ? 5 ? bump, 0.960 mm x 1.330 mm footprint chip scale package (csp) ? these devices are pb ? free and are rohs compliant applications ? esd protection for sensitive electronic equipment ? i/o port and keypad and button circuitry protection for portable devices ? can be used for emi filtering when combined with external series resistance ? wireless handsets ? handheld pcs / pdas ? mp3 players ? digital camcorders ? notebooks ? desktop pcs marking diagram device package shipping ? ordering information http://onsemi.com CSPESD304 csp ? 5 (pb ? free) 3500/tape & reel wlcsp5 case 567ay ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. e = CSPESD304 electrical schematic e esd_1 esd_2 esd_3 esd_4 a1 a3 c1 c3 b2 gnd
CSPESD304 http://onsemi.com 2 table 1. pin descriptions 5 ? bump csp package pin name description a1 esd_1 esd channel 1 a3 esd_2 esd channel 2 b2 gnd device ground c1 esd_3 esd channel 3 c3 esd_4 esd channel 4 package / pinout diagrams orientation marking (see note) CSPESD304 csp package top view (bumps down view) bottom view (pins up view) 1 2 3 c1 c3 a1 a3 b2 a b c + a1 orientation marking note: lead ? free devices are specified by using a ?+? character for the top side orientation mark. specifications table 2. absolute maximum ratings parameter rating units storage temperature range ? 65 to +150 c dc package power rating 200 mw stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. table 3. standard operating conditions parameter rating units operating temperature range ? 40 to +85 c table 4. electrical operating characteristics (note 1) symbol parameter conditions min typ max units v diode diode reverse breakdown voltage i diode = 10 a 5.5 v i leak diode leakage current v in = 3.3 v, t a = 25 c 100 na v sig signal voltage positive clamp negative clamp i diode = 10 ma 5.6 ? 0.4 6.8 ? 0.8 9.0 ? 1.5 v v esd in ? system esd withstand voltage a) human body model, mil ? std ? 883, method 3015 b) contact discharge per iec 61000 ? 4 ? 2 level 4 (note 2) 30 15 kv v cl clamping voltage during esd discharge mil ? std ? 883 (method 3015), 8 kv positive transients negative transients (note 2) +15 ? 8 v c diode diode capacitance at 2.5 vdc reverse bias, 1 mhz, 30 mvac 22 27 32 pf 1. t a = ? 40 to +85 c unless otherwise specified. 2. esd applied to input and output pins with respect to gnd, one at a time.
CSPESD304 http://onsemi.com 3 performance information diode characteristics (nominal conditions unless specified otherwise) figure 1. typical diode capacitance vs. input voltage (normalized to 2.5 vdc) figure 2. frequency response (single channel vs. gnd, in 50 system)
CSPESD304 http://onsemi.com 4 application information parameter value pad size on pcb 0.240 mm pad shape round pad definition non ? solder mask defined pads solder mask opening 0.290 mm round solder stencil thickness 0.125 mm ? 0.150 mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300 mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball 50 m solder ball side coplanarity 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for lead ? free devices using a lead ? free solder paste 260 c non ? solder mask defined pad 0.240 mm dia. solder stencil opening 0.300 mm dia. solder mask opening 0.290 mm dia. figure 3. recommended non ? solder mask defined pad illustration figure 4. lead ? free (snagcu) solder ball reflow profile 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature ( c)
CSPESD304 http://onsemi.com 5 package dimensions wlcsp5, 0.96x1.33 case 567ay ? 01 issue o seating plane 0.05 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max 0.56 millimeters a1 d 0.96 bsc e b 0.29 0.35 ed 0.50 bsc 0.72 d e a b pin a1 reference ed a 0.05 b c 0.03 c 0.05 c 5x b 123 c b a 0.05 c a a1 a2 c 0.21 0.27 1.33 bsc ee 0.435 bsc 0.50 0.25 5x dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.25 0.87 0.44 0.05 c 2x top view side view bottom view note 3 ee a2 0.40 ref recommended a1 package outline ed/2 and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 CSPESD304/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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